Earlier this month, Sony gave us the first version within the PlayStation 5 A tear video It explored the upcoming console area by piece. Now, there is the Japanese specialty site 4Camer Published an interview The video features Yasuhiro Ottori, a Sony hardware design engineer.
That interview (Google Translate, Reset user translation) Goes a lot of risky details in the design decisions behind Sony’s uniquely shaped console and focuses heavily on the unit’s heat dissipation technology. A clear plan is to “improve” the speed of the cooling fan based on a game with downloadable system updates.
“Various games will appear in the future, and the APU [accelerated processing unit] Behavioral data will be collected for each game, “Otori said.” Based on this, there is a plan to proceed by improving fan control. “
That performance analysis is based on data sent from the temperature sensor in the APU and the other three data mounted on the PS5’s motherboard, according to the interview (the higher measured temperature will be used to determine fan speed). 4 Gamer considers this bulk data to be particularly useful when a game with a high load continues for a long time. [making it] It can increase the fan volume and increase cooling efficiency even at the loss of quietness. “
In the interview, the 4 Gamer, the system’s 120mm diameter, 45mm thick fan that pushes air on both sides of the dual – sided motherboard, “is too big and thick for an electric fan fitted on a gaming machine.” This allows for a slower turn compared to a larger fan, which leads to “a greater amount of silence … under normal operating conditions”.
In the tear gas video, Ottory said of the PS5 Increased volume Led to “dramatic improvements in terms of processing power and quiet” on the PS4. Early reports Public opinion confirmed from Japanese newspapers that this should be good news for PlayStation owners to use for loud computer fans Spiral Such as Jet engines Under heavy load.
Cooling at cost
Ottori referred to the PS5’s liquid metal conductor as an unusual DIM (thermal interface material) below the CPU. That gallium alloy is often highly corrosive to the aluminum used in heat sinks, however, the PS5 has a silver-plated module to prevent corrosion that meets its heat sink APU, Ottory said.
Ottory said that despite the unusual design, and the increased cost of liquid metal DIM, the decision to use it helped reduce the overall cost of the PS5. This is because liquid gallium DIM allowed Sony to obtain the same cooling performance from a cheaper heat sink.
Ottori said cost reductions also came into effect when determining the physical dimensions of the PS5. At one point, Ottori said the company was considering a design that would “reduce the height and widen the width accordingly”. It seems that the shape of the system is similar to the short, square Xbox Series X (when both systems stand vertically).
Aside from aesthetic considerations, Ottori said it would be difficult to fit PS5’s components into a single motherboard by changing the dimensions of the PS5. This may complicate the arrangement of the system components.
“With two boards, the cost of production and the difficulty of heat dissipation design will increase,” Otori said. “The need for design to make it look thinner when placed horizontally and the need for cost reduction with a board are intertwined.”
Other notes from Ottori’s interview:
- If you are concerned, “there is no difference in cooling performance between vertical and horizontal installation,” says Otori.
- The PS5’s 350W power supply is built into the front and rear splits, allowing direct air flow from the system’s cooling fan.
- On the other hand, the optical drive is completely enclosed in a dual insulation layer, which “acts as a suspension and absorbs vibrations from the optical drive module.”
Lists the image by Sony / YouTube
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